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  soic ? 8 nb case 751 ? 07 issue ak date 16 feb 2011 seating plane 1 4 5 8 n j x 45  k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751 ? 01 thru 751 ? 06 are obsolete. new standard is 751 ? 07. a b s d h c 0.10 (0.004) scale 1:1 styles on page 2 dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ? x ? ? y ? g m y m 0.25 (0.010) ? z ? y m 0.25 (0.010) z s x s m  xxxxx = specific device code a = assembly location l = wafer lot y = year w = work week  = pb ? free package generic marking diagram* 1 8 *this information is generic. please refer to device data sheet for actual part marking. pb ? free indicator, ?g?, may or not be present. xxxxx alywx 1 8 ic discrete xxxxxx ayww  1 8 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155  mm inches  scale 6:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* discrete xxxxxx ayww 1 8 (pb ? free) xxxxx alywx  1 8 ic (pb ? free) xxxxxx = specific device code a = assembly location y = year ww = work week  = pb ? free package mechanical case outline package dimensions http://onsemi.com 1 ? semiconductor components industries, llc, 2002 october, 2002 ? rev. 0 case outline number: xxx document number: status: new standard: description: 98asb42564b on semiconductor standard soic ? 8, nb electronic versions are uncontrolled except when accessed directly from the document repository. printed versions are uncontrolled except when stamped ?controlled copy? in red. page 1 of 3
style 4: pin 1. anode 2. anode 3. anode 4. anode 5. anode 6. anode 7. anode 8. common cathode style 1: pin 1. emitter 2. collector 3. collector 4. emitter 5. emitter 6. base 7. base 8. emitter style 2: pin 1. collector, die, #1 2. collector, #1 3. collector, #2 4. collector, #2 5. base, #2 6. emitter, #2 7. base, #1 8. emitter, #1 style 3: pin 1. drain, die #1 2. drain, #1 3. drain, #2 4. drain, #2 5. gate, #2 6. source, #2 7. gate, #1 8. source, #1 style 6: pin 1. source 2. drain 3. drain 4. source 5. source 6. gate 7. gate 8. source style 5: pin 1. drain 2. drain 3. drain 4. drain 5. gate 6. gate 7. source 8. source style 7: pin 1. input 2. external bypass 3. third stage source 4. ground 5. drain 6. gate 3 7. second stage vd 8. first stage vd style 8: pin 1. collector, die #1 2. base, #1 3. base, #2 4. collector, #2 5. collector, #2 6. emitter, #2 7. emitter, #1 8. collector, #1 style 9: pin 1. emitter, common 2. collector, die #1 3. collector, die #2 4. emitter, common 5. emitter, common 6. base, die #2 7. base, die #1 8. emitter, common style 10: pin 1. ground 2. bias 1 3. output 4. ground 5. ground 6. bias 2 7. input 8. ground style 11: pin 1. source 1 2. gate 1 3. source 2 4. gate 2 5. drain 2 6. drain 2 7. drain 1 8. drain 1 style 12: pin 1. source 2. source 3. source 4. gate 5. drain 6. drain 7. drain 8. drain style 14: pin 1. n ? source 2. n ? gate 3. p ? source 4. p ? gate 5. p ? drain 6. p ? drain 7. n ? drain 8. n ? drain style 13: pin 1. n.c. 2. source 3. source 4. gate 5. drain 6. drain 7. drain 8. drain style 15: pin 1. anode 1 2. anode 1 3. anode 1 4. anode 1 5. cathode, common 6. cathode, common 7. cathode, common 8. cathode, common style 16: pin 1. emitter, die #1 2. base, die #1 3. emitter, die #2 4. base, die #2 5. collector, die #2 6. collector, die #2 7. collector, die #1 8. collector, die #1 style 17: pin 1. vcc 2. v2out 3. v1out 4. txe 5. rxe 6. vee 7. gnd 8. acc style 18: pin 1. anode 2. anode 3. source 4. gate 5. drain 6. drain 7. cathode 8. cathode style 19: pin 1. source 1 2. gate 1 3. source 2 4. gate 2 5. drain 2 6. mirror 2 7. drain 1 8. mirror 1 style 20: pin 1. source (n) 2. gate (n) 3. source (p) 4. gate (p) 5. drain 6. drain 7. drain 8. drain style 21: pin 1. cathode 1 2. cathode 2 3. cathode 3 4. cathode 4 5. cathode 5 6. common anode 7. common anode 8. cathode 6 style 22: pin 1. i/o line 1 2. common cathode/vcc 3. common cathode/vcc 4. i/o line 3 5. common anode/gnd 6. i/o line 4 7. i/o line 5 8. common anode/gnd style 23: pin 1. line 1 in 2. common anode/gnd 3. common anode/gnd 4. line 2 in 5. line 2 out 6. common anode/gnd 7. common anode/gnd 8. line 1 out style 24: pin 1. base 2. emitter 3. collector/anode 4. collector/anode 5. cathode 6. cathode 7. collector/anode 8. collector/anode style 25: pin 1. vin 2. n/c 3. rext 4. gnd 5. iout 6. iout 7. iout 8. iout soic ? 8 nb case 751 ? 07 issue ak date 16 feb 2011 style 26: pin 1. gnd 2. dv/dt 3. enable 4. ilimit 5. source 6. source 7. source 8. vcc style 27: pin 1. ilimit 2. ovlo 3. uvlo 4. input+ 5. source 6. source 7. source 8. drain style 28: pin 1. sw_to_gnd 2. dasic_off 3. dasic_sw_det 4. gnd 5. v_mon 6. vbulk 7. vbulk 8. vin style 29: pin 1. base, die #1 2. emitter, #1 3. base, #2 4. emitter, #2 5. collector, #2 6. collector, #2 7. collector, #1 8. collector, #1 style 30: pin 1. drain 1 2. drain 1 3. gate 2 4. source 2 5. source 1/drain 2 6. source 1/drain 2 7. source 1/drain 2 8. gate 1 http://onsemi.com 2 ? semiconductor components industries, llc, 2002 october, 2002 ? rev. 0 case outline number: xxx document number: status: new standard: description: 98asb42564b on semiconductor standard soic ? 8, nb electronic versions are uncontrolled except when accessed directly from the document repository. printed versions are uncontrolled except when stamped ?controlled copy? in red. page 2 of 3
document number: 98asb42564b page 3 of 3 issue revision date ab added style 25. req. by s. chang. 15 mar 2004 ac added corrected marking diagrams. req. by s. farretta. 13 aug 2004 ad corrected marking diagram for discrete. req. by s. farretta. 18 nov 2004 ae updated scale on footprint. req. by s. west. 31 jan 2005 af updated marking diagrams. req. by s. west. added style 26. req. by s. chang. 14 apr 2005 ag added style 27. req. by s. chang. 30 jun 2005 ah added style 28. req. by s. chang. 09 mar 2006 aj added style 29. req. by d. helzer. 19 sep 2007 ak added style 30. req. by i. cambaliza. 16 feb 2011 ? semiconductor components industries, llc, 2011 february, 2011 ? rev. 07ak case outline number: 751 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.


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